US Plans $825 Million Investment For New York Semiconductor R&D Facility

The Biden administration is investing $825 million in a new semiconductor research and development facility in Albany, New York. Reuters reports: The New York facility will be expected to drive innovation in EUV technology, a complex process necessary to make semiconductors, the U.S. Department of Commerce and Natcast, operator of the National Semiconductor Technology Center (NTSC) said. The launch of the facility “represents a key milestone in ensuring the United States remains a global leader in innovation and semiconductor research and development,” Commerce Secretary Gina Raimondo said. From the U.S. Department of Commerce press release: EUV Lithography is essential for manufacturing smaller, faster, and more efficient microchips. As the semiconductor industry pushes the limits of Moore’s Law, EUV lithography has emerged as a critical technology to enable the high-volume production of transistors beyond 7nm, previously unattainable. As the NSTC develops capabilities and programs, access to EUV lithography R&D is essential to meet its three primary goals 1) extend U.S. technology leadership, 2) reduce the time and cost to prototype, and 3) build and sustain a semiconductor workforce ecosystem.

Read more of this story at Slashdot. Read More